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CM-100R Sapphire Wafer Laser Cutter

Type CM-100R
Size 1200*1350*1700 (mm)
Power 1Φ 220V 20A
Application Wafer 2”4”6”
Function The robot shift the wafer to the position for laser carving on both sides of the product . It enhance the equipment stability and reduce the product contamination.
Features Insert Rate : ≧99.0%(PCS)
Index Time : 15 sec/pcs (Based on 2” Wafer)
Post Date:2021/9/24