PR-200M Fully-automated Plasma Cleaning Machine
| Type |
PR-200M |
| Size |
1083*1233*1754 (mm) |
| Power |
3Φ 220V 32A |
| Application |
IC packaging (BGA/Lead Frame/Flip Chip/CSP/QFN), LED packaging, SMT, PCB, Photoelectric componnet, Electronic component. |
| Function |
Cleaning and printing before laminate-sealing or surface roughening or cleaning before coheding.
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| Features |
1. Capacitance-type electrode. Using RF power supply.
2. Faster processing speed. Higher cleaning Efficiency. Higher reliability.
3. Under vacuum environment, it improves the surface cleanliness and prevent the organic contamination.
4. Improving the strength and reliability required for connecting with the component. Enhancing Y-rate and reducing the manufacturing cost.
5. Simple operation interface.
6. Cavity Design, can clean more product
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